The IDM 2.0 strategy, which Intel’s new CEO Patrick Gelsinger announced at today’s event, implies a closer partnership with IBM on fundamental development. Mutual assistance should extend to technical processes and layout solutions.

Actually, the Intel head during his speech did not give many details about the specifics of cooperation with IBM, but the AnandTech resource found an opportunity to expand comments on this topic. It is obvious that IBM has impressive potential in the field of lithography, although it has not produced its own processors for a long time. At one time, IBM helped to master the new technical processes of AMD, and the cooperation continued after the transfer of AMD’s production facilities to GlobalFoundries. Ultimately, GlobalFoundries became the owner of manufacturing facilities and IBM itself. The latest generation of POWER processors, however, is manufactured using 7nm technology from Samsung Electronics.

It cannot be ruled out that Intel, with the successful development of new lithographic technologies, will eventually be able to offer IBM services for contract manufacturing of processors. In the meantime, the two companies are going to join forces in the field of fundamental research that will help them advance in lithographic technology. The scope for experiments is great – this is the use of new materials for forming transistors, and the use of new layout solutions, on which Intel is betting. While research teams from Intel and IBM will conduct parallel work in Oregon and New York state, respectively, but it cannot be ruled out that over time they will unite geographically if necessary.

Along the way, the head of Intel announced an initiative to revive events such as a forum for IDF developers. They will be hosted under the Intel ON banner, while engaging marketing, sales and development professionals. The first event in the new format will take place in October in San Francisco.