ASUS is preparing for the presentation of its next gaming flagship ROG Phone, which, as previously confirmed, will be built on Snapdragon 8+ Gen 1. Since the announcement of the presentation date (July 5), the Taiwanese have not spoiled us with new teasers for the smartphone, but now they have taken the floor and said something interesting. ROG Phone 6 will receive significantly improved cooling means: a 30% larger vapor chamber and an 85% (!) Larger graphite plate. By this, the manufacturer seems to be hinting that the overclocked Qualcomm flagship will also generate a lot of heat, like its current counterpart, so the leading gaming phone will need additional support. In previous generations, with the stability of ROG Phone, everything was very good.

Note that Qualcomm Snapdragon 8 Gen 1 has noticeable problems with heating, which makes the throttling feel stronger than the user would like. Snapdragon 8+ Gen 1 should switch to TSMC’s 4nm architecture (Samsung’s standard eight), which is supposedly designed to increase stability and level out some of the throttling. ROG Phone 6 will be one of the first to put these hopes to the test. We wait!

© Artur Luchkin. mobile phone

According to ASUS