ASUS recently introduced the ROG Phone 6 gaming phone, which, even at the pre-release promotion stage, was praised for the cooling system for the Snapdragon 8+ Gen 1 chipset. Now that the smartphone is already in the hands of a number of users, it is possible to look at the design clearly. Chinese craftsmen dismantled and showed how the fresh ROG Phone is assembled, what components it consists of. It is curious that the motherboard-sandwich is located exactly in the center of the case, richly smeared with thermal paste. This allows you to make the best use of the latest wireless cooler also mentioned in the video. We will deal with optimization later. Recall that the price of ROG Phone 6 starts at 999 euros.

© Artur Luchkin. mobile phone