The partnership between TSMC and Apple to create more efficient chips has led to several breakthroughs, including the Mac’s move to the 5nm M1 SoC. However, smartphones using 3nm chips will appear in the foreseeable future, followed by 2nm. To accelerate this transition, according to a new report, TSMC and Apple have teamed up.

TSMC is currently deploying a separate 3nm manufacturing facility in Baoshan, China, near Hsinchu, primarily to fulfill Intel’s advanced chip orders. However, more interesting is the fact that Apple is helping the Taiwanese giant to push the boundaries of the development of advanced silicon processors – we are talking, first of all, about research and development in the field of mastering the 2nm process technology.

Apparently, both TSMC and Apple are working together to speed up mass production of chips in compliance with 2nm standards. Moreover, it is reported that TSMC has already begun the initial preparation of the site for the construction of an enterprise designed exclusively for the production of 2nm chips. And the plant in Baoshan will be used to test and run the new technology. Earlier it was said that TSMC had already received orders for 2nm chips, although no customer names were mentioned (now at least Apple is known).

It is also reported that Apple has already received from TSMC the first test batches of chips released in compliance with 3nm standards. But wait for an iPhone, iPad or Mac with 3nm chips this year. According to estimates, in 2021, 80% of TSMC’s 5nm chips will be printed on Apple orders, and the future A15 Bionic single-chip system will be produced according to slightly more advanced N5P standards (improved 5nm).

It is expected that in 2022 TSMC will begin mass production of 3nm chips, and test printing of 2nm crystals is planned no earlier than 2023, so it is better not to hope for mass production before 2024.