A few days ago , Qualcomm introduced the 4nm Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1 processors. And now MediaTek has announced its chips: Dimensity 1080, Dimensity 930 and Helio G99.
The new SoCs share a common design and are in line with the premium, mid-range, and entry-level range. Dimensity 1050 was the most powerful and the first to support mmWave.
The MediaTek Dimensity 1050 is the most powerful processor announced by MediaTek in this batch, although its own numbering makes it clear that it is not the top of the line: it is based on a 6nm architecture.
The main feature of the Dimensity 1050 is that it is the first MediaTek chip to support 5G mmWave (and also for frequencies below 6 GHz), with real dual connectivity and certifications already ready for some markets.
The Dimensity 1050 is complemented by a Mali-G610 MC3 GPU and a MediaTek APU 550 APU. It supports LPDDR5 and UFS 3.1, 108MP cameras, 144Hz screens, and Wi-Fi 6E with Bluetooth 5.2. The first mobile phones with this chip will be released in the second quarter of this year.
The second chip featured is MediaTek’s Dimensity 930, also based on the 6nm architecture and very similar to the Dimensity 920, though not technically faster, as its numbering suggests.
And if the Dimensity 920 has two Cortex-A78 cores at 2.5 GHz and six Cortex-A55 cores at 2.0 GHz, the Dimensity 930 has two Cortex-A78 cores at 2.2 GHz and six Cortex-A55 cores at 2 GHz .
Also, the new chip has lost the ARM GPU and will be replaced by the IMG BXM-8-256, which supports displays with a resolution of 2520 × 1080 at 120 Hz, as well as cameras up to 108 megapixels.
The Dimensity 930 is enhanced with HyperEngine 3.0 Lite gaming optimizations and memory support up to LPDDR5 and UFS 3.1, Wi-Fi 5 and Bluetooth 5.2. The first phones based on this chip will be released in the third quarter.
Finally, Helio G99, which has become a continuation of Helio G96 from last year. And the most important change is its design, since Helio G96 has a 12nm architecture, while the new Helio G99 is 6nm.
The biggest advantage of this chip is the lower power consumption, which MediaTek estimates at 30% compared to the previous one. The processor received two Cortex-A76 cores with 2.2 GHz and six more Cortex-A55 cores with 2 GHz.
Helio G96 includes MediaTek HyperEngine 2.0 Lite optimization and supports Full HD+ displays up to 120Hz, 4X LPDDR memory, UFS 2.2 storage and cameras up to 108MP.
Connectivity is still Cat-13 4G LTE, dual, with support for Wi-Fi 5 and Bluetooth 5.2. The first phones with Helio G99 will appear only in the third quarter of this year.
In addition, Mediatek introduced the Filologic 380 and 880 WiFi 7 compatible chips for various devices. Filologic 380 will be installed on laptops, WiFi expansion modules and motherboards. Perhaps the first to receive them are future laptops with AMD Ryzen, which will hit the market during 2023.
The chip supports 2.4GHz, 5GHz, and 6GHz bands and speeds up to 6.5Gbps.
The second chip – Mediatek Filologic 880 – is designed for routers and access points. Through the introduction of a processor based on four Cortex A72 cores and a neural processor for managing network packets, speeds of up to 36 Gb / s are possible on five bands. On one channel will be up to 10 Gb / s.
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